Engineers: [Spring 2024] Virtual Campus Recruitment (5416)

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona multiple engineering departments are looking for engineering talents to join our 5-nanometer fab, located in sunny Phoenix. You will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

Module Process Engineer (PE) is responsible for delivering a robust and efficient semiconductor manufacturing process with data driven analytics and systematic problem-solving skills. You will work closely with other innovators in device, integration, defect reduction, lithography, etch and thin films teams to drive leading-edge integrated module development, control, and improvements to resolve issues or specific request from our customers

Module Equipment Engineer (EE) is focusing on improving tool performance and availability while meeting uptime and cycle time requirements. You will be in charge of maintenance, warm-up and troubleshooting for equipment of each module to improve the operation efficiency, as well as plans and executes projects of analysis and defect detection

Modules 

• CMP: Chemical Mechanical Planarization
• CVD: Chemical Vapor Deposition
• PVD: Physical Vapor Deposition
• DIF: Diffusion
• WET: Wet Clean
• Etch: Etching (Dry Etch)
• LIT: Lithography

Process Integration Engineer (PIE) is focusing on helping customers achieve a successful full lifecycle on their products, including New Product Introduction (NPI), device performance, yield, and reliability, using our most advanced technology.

Yield Enhancement Engineer (YED) is responsible for Defect reduction, Yield improvement, and Inspection methodology excellence.

Intelligent Manufacturing Engineer (MFG) is responsible for improving productivity of daily operations, ensuring all operation, workflow, and quality activities are consistent with agreed upon service operations, and driving manufacturing excellence.

Advanced Material Handling System Integration Engineer (AMHS) is responsible for leading new technology transfers, new production line set up, maintenance, quality, and productivity improvement to ensure a smooth production operation.

Computer Integrated Manufacturing Engineer (CIM) is responsible for developing and maintaining intelligent manufacturing systems.

E-Beam Engineer (EBO) is responsible for EUV and Optical mask making including leading edge mask writing, inspection, repair, cleaning, and metrology technology.

Material Engineer – WET responsible for sustaining ownership such as day-to-day raw material operations to achieve the best quality, reliability, and delivery of goods.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

• A minimum of a B.S. Degree in an engineering and scientific field such as Material Science, Chemical Engineering, Chemistry, Electrical and Electronics Engineering, Mechanical Engineering, Physics, or semiconductor manufacturing.
• Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
• Able to adapt priorities and responsibilities to support business needs.
• A team player that can multitask and thrive in a very dynamic and fast-paced environment. List physical requirements here (other than those common across all jobs – e.g., lifting, bending or extended walking requirements).
• Research project, course works or internship experience in semiconductor manufacturing is preferred.

Work Location: Phoenix, AZ

Training Location: Phoenix, AZ